Northrop Grumman. has filed a patent for a method of making a photonic integrated circuit (PIC) by depositing a functional resist material layer, pressing a stamp with nanopatterns, and removing the stamp to create nanofeatures forming optical elements. The claim describes a PIC with a nanoimprinted resist structure over a substrate. GlobalData’s report on Northrop Grumman gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Northrop Grumman, Superconducting quantum circuits was a key innovation area identified from patents. Northrop Grumman's grant share as of January 2024 was 66%. Grant share is based on the ratio of number of grants to total number of patents.
Photonic integrated circuit with nanoimprinted resist structure
A photonic integrated circuit (PIC) described in a filed patent (Publication Number: US20240027687A1) includes a substrate and a nanoimprinted resist structure with features forming optical elements. The resist structure can be photo-curable or thermally-curable, primarily composed of silica, titanium oxide, or semiconductor particles, and has a refractive index between 1.5 and 4.0. The substrate, with a refractive index below 1.5, can be made of materials like glass, quartz, silicon, or sapphire. The resist structure features varying heights and nanometer-scale details, created using a single stamp with inverted nanopatterns.
Another aspect of the PIC patent involves an encapsulation layer with a lower refractive index than the resist structure, providing additional functionality. The resist structure, similar to the previous claim, can be inorganic and formed from photo-curable or thermally-curable materials. The substrate remains consistent with a refractive index below 1.5 and materials like glass, quartz, silicon, or sapphire. The resist structure's features, created using a single stamp with inverted nanopatterns, include varying heights and details at different length scales. This innovative approach to designing a photonic integrated circuit offers a unique combination of materials and fabrication techniques to enhance optical performance and functionality.
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