MBDA Holdings has patented a method for connecting printed circuits and electronic components through brazing. The process involves forming stacks of stud bumps on one element, applying a brazing product, arranging the second element, and remelting to create a brazed joint, enhancing precision in electronic device assembly. GlobalData’s report on MBDA Holdings gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on MBDA Holdings, was a key innovation area identified from patents. MBDA Holdings's grant share as of July 2024 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
Brazing method for connecting electronic components to circuits
The granted patent US12070812B2 outlines a method for connecting a printed circuit to an electronic component through a brazing process. The method involves several key steps, starting with the formation of multiple stacks of stud bumps on one of the elements. Each stack consists of a predetermined number of bumps, which are created through a series of sub-steps that include heating a metal wire, depositing a metal ball, crushing and welding the ball, and then separating the wire. Following the formation of these bumps, a brazing product is deposited on either the first or second element, after which the second element is arranged on the first. The final step involves remelting the brazing product to establish a brazed joint, ensuring that the brazing product directly contacts the first element's face post-remelting.
The patent further specifies that the bumps can be made from materials such as gold, copper, silver, or platinum, with individual bump heights ranging from 20 µm to 30 µm and stack heights between 110 µm and 150 µm. The method allows for the connection of multiple electronic components to a single printed circuit, enhancing the versatility of electronic device assembly. Additionally, the claims indicate that the brazing product can be applied to either element, and the resulting brazed joints may extend between adjacent stacks of stud bumps. This innovative approach aims to improve the reliability and efficiency of electronic device manufacturing by providing a robust connection method between critical components.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
